JPS5037366A - - Google Patents
Info
- Publication number
- JPS5037366A JPS5037366A JP8755573A JP8755573A JPS5037366A JP S5037366 A JPS5037366 A JP S5037366A JP 8755573 A JP8755573 A JP 8755573A JP 8755573 A JP8755573 A JP 8755573A JP S5037366 A JPS5037366 A JP S5037366A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8755573A JPS5037366A (en]) | 1973-08-06 | 1973-08-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8755573A JPS5037366A (en]) | 1973-08-06 | 1973-08-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5037366A true JPS5037366A (en]) | 1975-04-08 |
Family
ID=13918221
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8755573A Pending JPS5037366A (en]) | 1973-08-06 | 1973-08-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5037366A (en]) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5112620A (ja) * | 1974-07-22 | 1976-01-31 | Fuji Electric Co Ltd | Sairisutashikidenryokuhenkansochi |
| JPS52164452U (en]) * | 1976-06-08 | 1977-12-13 | ||
| JPS52154022A (en) * | 1976-06-18 | 1977-12-21 | Agency Of Ind Science & Technol | Control system for thyristor chopper circuit |
| JPS53102375U (en]) * | 1977-01-21 | 1978-08-18 | ||
| JPS5443525A (en) * | 1977-09-13 | 1979-04-06 | Meidensha Electric Mfg Co Ltd | Chopper device for controlling dc power |
| JPS5444869A (en) * | 1978-08-21 | 1979-04-09 | Hitachi Ltd | Transistor |
| JPS63137460A (ja) * | 1986-11-28 | 1988-06-09 | Ibiden Co Ltd | 半導体チツプ搭載用プリント配線板 |
| JPH0179843U (en]) * | 1987-11-18 | 1989-05-29 | ||
| WO2002043135A1 (en) * | 2000-11-22 | 2002-05-30 | Niigata Seimitsu Co., Ltd. | Semiconductor device and its manufacturing method |
-
1973
- 1973-08-06 JP JP8755573A patent/JPS5037366A/ja active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5112620A (ja) * | 1974-07-22 | 1976-01-31 | Fuji Electric Co Ltd | Sairisutashikidenryokuhenkansochi |
| JPS52164452U (en]) * | 1976-06-08 | 1977-12-13 | ||
| JPS52154022A (en) * | 1976-06-18 | 1977-12-21 | Agency Of Ind Science & Technol | Control system for thyristor chopper circuit |
| JPS53102375U (en]) * | 1977-01-21 | 1978-08-18 | ||
| JPS5443525A (en) * | 1977-09-13 | 1979-04-06 | Meidensha Electric Mfg Co Ltd | Chopper device for controlling dc power |
| JPS5444869A (en) * | 1978-08-21 | 1979-04-09 | Hitachi Ltd | Transistor |
| JPS63137460A (ja) * | 1986-11-28 | 1988-06-09 | Ibiden Co Ltd | 半導体チツプ搭載用プリント配線板 |
| JPH0179843U (en]) * | 1987-11-18 | 1989-05-29 | ||
| WO2002043135A1 (en) * | 2000-11-22 | 2002-05-30 | Niigata Seimitsu Co., Ltd. | Semiconductor device and its manufacturing method |